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Commell HS-771 Half-Size PCI SBC supports Intel Core 2 Duo Mobile

HalfSize PCI SBC supports Intel Core 2 Duo Mobile

Description

Commell HS-771 HalfSize PCI SBC supports Intel Core 2 Duo Mobile

Product Manual | Product Drivers

Additional information

Specifications
CPU

Intel Core 2 Duo MobileIntel Core 2 ExtremeIntel Celeron 5xx Series

CPU Socket

mFCPGA-478 (Socket P)

Memory Slots

2 x 204-pin SO-DIMM

Maximum Memory Supported

4 GB

Memory Standard

800/1066 MHz DDR3 SDRAM

ECC Memory Supported

No

Onboard Memory

No

Dual Channel Memory Support

Yes

Chipset

Intel GM45 + ICH9M

BIOS

Award BIOS

Video Chipset

Intel integrated extreme GMA X4500 graphics accelerator (1920 x 1200 max. resolution)

Watchdog Timer

Generates system reset. Internal timer 1 ~ 255 minutes

Real Time Clock

Chipset integrated RTC with onboard lithium battery

Serial ATA (SATA)

4 x SATA-300

IDE Controller

No

Compact Flash

No

Disk On Chip (DOC)

No

Video Memory

Up to 1024MB Shared with System Memory

Audio Chipset

Intel integrated ICH9M with Realtek HD Audio codec

10/100(Fast) LAN

No

Gigabit LAN Ports

2 x Intel 82574L 10/100/1000 LAN

GPIO Port

1 x 8-bit digital I/O interface

PCI Express Mini-Card (Mini-PCIe)

1 x Mini-PCIe

PCIe Socket

No

PCI Slot

4 x PCI

Mini-PCI Socket

1 x Mini PCI supports Type IIIA

ISA Slot

No

Mini-AGP Slot

No

PC/104

No

PC/104 Plus

No

Serial (COM) Port

1 x RS-232C, 1 x RS-232C/422/485 (internal)

USB Port

8 x USB 2.0 (internal)

HDMI

No

LVDS

1 x 24-bit Dual Channel LVDS (internal), 1 x LCD inverter

VGA

1 x VGA (internal)

Audio

1 x Audio (internal)

PS/2 Port

1 x PS/2 for Keyboard/Mouse (external), 1 x AT KB (internal)

Floppy Port

No

HDTV-Out

1 x HDTV (internal)

IrDA Port

1 x IrDA (internal)

LPT (Parallel) Port

No

TV-Out

No

Approximate Weight

1.32 lb (0.6 Kg)

Dimensions

W: 7.2" x D: 4.8" (185mm x 122mm)

Operating Temperature

32 ~ 140-° F (0 ~ 60-° C)

Storage Temperature

-4 ~ 185-° F (-20 ~ 85-° C)

Relative Humidity

10 ~ 90 % non-condensing

Global P/N / SKU

3308870

More
Form Factor

Half-Size PCI SBC

Power Consumption

Maximum TDP is 51 Watts

SPDIF

No

Power Management

ACPI 2.0 complient, supports power saving mode

FSB

667/800/1066 MHz

Power Connector

DC 5/V12V power required, optional 5VSB or ATX, Onboard 4-pin Molex and 3-pin ATX

TTL

1 x TTL supported

Super I/O Chipset

Winbond 83627DHG

3308870: Half-Size PCI SBC supports Intel Core 2 Duo Mobile

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