Em104-i613VL/C650 PC 104 CPU Module with ULV Fanless Intel Celeron

3003050 - PC 104 CPU Module with ULV Fanless Intel Celeron

Additional information

Weight	1 kg
Audio Chipset	N/A
Global P/N / SKU	3003050
Memory Standard	100MHz SDRAM
Video Chipset	VIA Twister-T S3 Savage4 Engine
MFR P/N	Em104-i613VL/C650
Manufacturer	Arbor
Chipset	VIA Twister-T VT8606T + VIA VT82686B
Dimensions	W: 3.5" (90 mm) x D: 3.8" (96 mm)
BIOS	Phoenix-Award PnP Flash BIOS
Ordering Options	3003050A: PC 104 CPU Module with ULV Fanless Intel Celeron (400MHz, 256KB Cache)3003050B: PC 104 CPU Module with ULV Fanless Intel Celeron (650MHz, 256KB Cache)
Product Features	PC 104 CPU Module with ULV Fanless Intel Celeron Dimensions:W: 3.5" (90 mm) x D: 3.8" (96 mm) FSB:100MHz CPU:Fanless Embedded Celeron (400MHz, 256KB Cache) or (650MHz, 256KB Cache) Chipsets:VIA Twist
Serial (COM) Port	2 x COM Ports (1 x RS232 via onboard header; 1 x RS-232/422/485 port via onboard header)
Discontinued	Yes

Out of stock

Weight	1 kg
Audio Chipset	N/A
Global P/N / SKU	3003050
Memory Standard	100MHz SDRAM
Video Chipset	VIA Twister-T S3 Savage4 Engine
MFR P/N	Em104-i613VL/C650
Manufacturer	Arbor
Chipset	VIA Twister-T VT8606T + VIA VT82686B
Dimensions	W: 3.5" (90 mm) x D: 3.8" (96 mm)
BIOS	Phoenix-Award PnP Flash BIOS
Ordering Options	3003050A: PC 104 CPU Module with ULV Fanless Intel Celeron (400MHz, 256KB Cache)3003050B: PC 104 CPU Module with ULV Fanless Intel Celeron (650MHz, 256KB Cache)
Product Features	PC 104 CPU Module with ULV Fanless Intel Celeron Dimensions:W: 3.5" (90 mm) x D: 3.8" (96 mm) FSB:100MHz CPU:Fanless Embedded Celeron (400MHz, 256KB Cache) or (650MHz, 256KB Cache) Chipsets:VIA Twist
Serial (COM) Port	2 x COM Ports (1 x RS232 via onboard header; 1 x RS-232/422/485 port via onboard header)
Discontinued	Yes

We can customize the perfect solution to meet your embedded computing needs.

Cincoze Launches GPU Embedded Computers
January 15, 2025

The paradigm of industrial computing has largely shifted from Cloud computing to Edge computing, but the rise of AI poses a new challenge. AI applications require powerful GPUs for their number crunching, while embedded PCs normally rely on integrated graphics alone to keep things efficient. To meet this need, Cincoze has come out with two […]
View Article

Partnering With Cincoze for Modular Embedded Solutions
December 16, 2024

Embedded PCs rarely work with the one-size-fits-all approach. Different applications have very different requirements, and without a process that can quickly roll out customized boards, putting together an industrial-scale setup can take ages. That’s why Global American is partnering with Cincoze, the leading manufacturer of modular embedded systems. Let’s find out what makes Cincoze computers […]
View Article

View All News

Cutting-Edge Semiconductors Start Rolling Out From Arizona Fab
May 15, 2025

Taiwan’s dominance in semiconductor manufacturing has long raised concerns over the availability of this critical resource. Now, high-quality chips are finally being manufactured domestically, and the production is looking to scale even further. But is it just a token facility, or are we looking at future production at scale? Let’s find out. The CHIPS Act […]
View Article

Intel’s 18A Process – The Future of Chip Manufacturing?
May 1, 2025

Intel’s new 18A foundry process has been making the headlines, being touted as a game-changer for chip fabrication and Intel’s place in the market. But what exactly is 18A and why is it such a big deal? Let’s take a look. How Chip Fabrication Works Semiconductor manufacturing is a very delicate process, with complex integrated […]
View Article

View all Blogs