FS-A73 Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors

Equipped Gaming Embedded System
Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors

Additional information

Weight

1 kg

Gigabit LAN Ports

1 x Intel 82574L Gigabit Ethernet Controller, (Option A, C, and E), 2 x Intel 82574L Gigabit Ethernet Controllers (options B, C, and F)

Power Consumption

System TDP of 38.5 Watts with an Intel Core i5-520M (3M Cache, 2.40 GHz) processor *

Audio Chipset

Intel Integrated Q57 with Realtek ALC888 HD Audio

Global P/N / SKU

3308562

Video Chipset

Intel Core Integrated HD Graphics (CPU Dependent)

Memory Standard

800 / 1066 MHz DDR3

MFR P/N

FS-A73

Manufacturer

Commell

Chipset

Mobile Intel QM57 express Chipset

Dimensions

W: 13.3" x 5.0" (338 mm x 126 mm)

Cost

0

Ordering Options

3308562A:Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors with 1 x Gigabit LAN, 1 x VGA, 1 x 24-bit LVDS3308562B:Full Size PICMG 1.3 SBC with Intel Q

Approximate Weight

1.0 lbs (0.45 kg)

Product Features

Dimensions: W: 13.3" x 5.0" (338 mm x 126 mm)  CPU: First Generation Intel Core i7 / Core i5 / Core i3 Series Mobile Processors BIOS Socket G1 (rPGA989/rPGA 988A) / Phoenix-Award Bios Chi

Serial (COM) Port

5 x RS-232 , 1 x RS-232C/422/485

BIOS

Phoenix-Award v6.00PG 32Mb SPI flash BIOS

FS-A73 Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors

Equipped Gaming Embedded System

Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors

CONTACT US NOW

Out of stock

Additional information

Weight

1 kg

Gigabit LAN Ports

1 x Intel 82574L Gigabit Ethernet Controller, (Option A, C, and E), 2 x Intel 82574L Gigabit Ethernet Controllers (options B, C, and F)

Power Consumption

System TDP of 38.5 Watts with an Intel Core i5-520M (3M Cache, 2.40 GHz) processor *

Audio Chipset

Intel Integrated Q57 with Realtek ALC888 HD Audio

Global P/N / SKU

3308562

Video Chipset

Intel Core Integrated HD Graphics (CPU Dependent)

Memory Standard

800 / 1066 MHz DDR3

MFR P/N

FS-A73

Manufacturer

Commell

Chipset

Mobile Intel QM57 express Chipset

Dimensions

W: 13.3" x 5.0" (338 mm x 126 mm)

Cost

0

Ordering Options

3308562A:Full Size PICMG 1.3 SBC with Intel QM57 Chipset for Intel Core i7 /i5 / i3 Mobile Processors with 1 x Gigabit LAN, 1 x VGA, 1 x 24-bit LVDS3308562B:Full Size PICMG 1.3 SBC with Intel Q

Approximate Weight

1.0 lbs (0.45 kg)

Product Features

Dimensions: W: 13.3" x 5.0" (338 mm x 126 mm)  CPU: First Generation Intel Core i7 / Core i5 / Core i3 Series Mobile Processors BIOS Socket G1 (rPGA989/rPGA 988A) / Phoenix-Award Bios Chi

Serial (COM) Port

5 x RS-232 , 1 x RS-232C/422/485

BIOS

Phoenix-Award v6.00PG 32Mb SPI flash BIOS

Some of our successful brand partners

Acrosser logo

Already know what you need? Request a quote.

We can customize the perfect solution to meet your embedded computing needs.

    • This field is for validation purposes and should be left unchanged.

    Latest Articles

    Company News

    • Cincoze Launches GPU Embedded Computers

      The paradigm of industrial computing has largely shifted from Cloud computing to Edge computing, but the rise of AI poses a new challenge. AI applications require powerful GPUs for their number crunching, while embedded PCs normally rely on integrated graphics alone to keep things efficient. To meet this need, Cincoze has come out with two […]

      View Article
    • Partnering With Cincoze for Modular Embedded Solutions

      Embedded PCs rarely work with the one-size-fits-all approach. Different applications have very different requirements, and without a process that can quickly roll out customized boards, putting together an industrial-scale setup can take ages.   That’s why Global American is partnering with Cincoze, the leading manufacturer of modular embedded systems. Let’s find out what makes Cincoze computers […]

      View Article
    View All News

    From the Blog

    • Cutting-Edge Semiconductors Start Rolling Out From Arizona Fab

      Taiwan’s dominance in semiconductor manufacturing has long raised concerns over the availability of this critical resource. Now, high-quality chips are finally being manufactured domestically, and the production is looking to scale even further. But is it just a token facility, or are we looking at future production at scale? Let’s find out.  The CHIPS Act […]

      View Article
    • Intel’s 18A Process – The Future of Chip Manufacturing?

      Intel’s new 18A foundry process has been making the headlines, being touted as a game-changer for chip fabrication and Intel’s place in the market. But what exactly is 18A and why is it such a big deal? Let’s take a look. How Chip Fabrication Works Semiconductor manufacturing is a very delicate process, with complex integrated […]

      View Article
    View all Blogs