HE-B73 – Half-size PICMG 1.3

The HE-B73, designed for the 11th generation Intel® Core™ H-series processor platform, provides excellent CPU, graphics, media performance, flexibility, and enhanced security.

Additional information

CPU

11th Gen Intel® Tiger Lake

CPU Socket

FCBGA1787

Memory Type

260-pin DDR4 3200 MHz SO-DIMM

Memory Slots

2

Maximum Memory Supported

64GB

Chipset

QM580E / RM590E (TGL-H Xeon CPUs have to use RM590E)

Integrated Graphics

Intel® UHD Graphics

Watchdog Timer

1 ~ 255 min/sec intervals, generates system reset

Serial ATA (SATA)

2 x SATA III

Video

1 x DVI, 1 x VGA, 1 x LVDS, 1 x DP (see Notes in Ordering Options)

LAN Ports

1 x Intel® I219-LM Gigabit LAN (Support Intel® AMT 15.0), 1 x Intel® I225-LM Gigabit LAN (Up to 2.5GbE)

GPIO Interface

Onboard programmable 8-bit Digital I/O interface

Extended Interface

1 x mini PCIe with SIM card slot (support mSATA), 1 x M.2 M-key (2280, PCIe Gen4 for NVMe), 1 x M.2 E-key (2230 for WiFi and Bluetooth), 1 x PCIeX16 slot (Gen4)

Backplane Support

1 x PCIe X16 and 4 x PCIe X1 OR 1 x PCIe X4 via backplane

Internal I/O

2 x SATA3, 4 x RS232, 2 x RS232/RS422/RS485, 1 x SMBus, 2 x USB 3.2 (Type E), 4 x USB 2.0, 1 x LVDS, 1 x LCD inverter connector

Rear I/O

2 x LAN, 1 x DisplayPort and 1 x PS/2

Audio

Realtek ALC888S HD Audio

Power Requirement

24-pin ATX power from Backplane

Dimensions

168 mm x 126 mm

Operating Temperature

0 ~ 60˚C (32 ~ 140˚F) (Wide Temp Version option is -40 ~ 85˚C)

Storage Temperature

-20 ~ 80 °C (-4 ~ 176 °F)

Relative Humidity

10 ~ 90% (non-condensing)

OS Software Supported

Windows 10 64-bit

Global P/N / SKU

3308586

ORDERING OPTIONS

HE-B7371 – With Core™ i7-11850HE, QM580E, Cooler fan, DVI, DP, LVDS, VGA, 4 x PCIe X1
HE-B7374 – Same as HE-B7371, with 1 x PCIe X4
Other CPU options may be available, please inquire with your Sales Rep

Note: For display interface questions, please contact your Sales Rep

DOWNLOADS

Datasheet

ORDERING OPTIONS

HE-B7371 - With Core™ i7-11850HE, QM580E, Cooler fan, DVI, DP, LVDS, VGA, 4 x PCIe X1 HE-B7374 - Same as HE-B7371, with 1 x PCIe X4 Other CPU options may be available, please inquire with your Sales Rep Note: For display interface questions, please contact your Sales Rep

HE-B73 – Half-size PICMG 1.3

The HE-B73, designed for the 11th generation Intel® Core™ H-series processor platform, provides excellent CPU, graphics, media performance, flexibility, and enhanced security.

CONTACT US NOW

Board

SKU: 3308586 Tags: Defense, Digital Signage, Gaming, Industrial Automation, Machine Vision, Medical Computing, Surveillance, Transportation

Additional information

CPU

11th Gen Intel® Tiger Lake

CPU Socket

FCBGA1787

Memory Type

260-pin DDR4 3200 MHz SO-DIMM

Memory Slots

2

Maximum Memory Supported

64GB

Chipset

QM580E / RM590E (TGL-H Xeon CPUs have to use RM590E)

Integrated Graphics

Intel® UHD Graphics

Watchdog Timer

1 ~ 255 min/sec intervals, generates system reset

Serial ATA (SATA)

2 x SATA III

Video

1 x DVI, 1 x VGA, 1 x LVDS, 1 x DP (see Notes in Ordering Options)

LAN Ports

1 x Intel® I219-LM Gigabit LAN (Support Intel® AMT 15.0), 1 x Intel® I225-LM Gigabit LAN (Up to 2.5GbE)

GPIO Interface

Onboard programmable 8-bit Digital I/O interface

Extended Interface

1 x mini PCIe with SIM card slot (support mSATA), 1 x M.2 M-key (2280, PCIe Gen4 for NVMe), 1 x M.2 E-key (2230 for WiFi and Bluetooth), 1 x PCIeX16 slot (Gen4)

Backplane Support

1 x PCIe X16 and 4 x PCIe X1 OR 1 x PCIe X4 via backplane

Internal I/O

2 x SATA3, 4 x RS232, 2 x RS232/RS422/RS485, 1 x SMBus, 2 x USB 3.2 (Type E), 4 x USB 2.0, 1 x LVDS, 1 x LCD inverter connector

Rear I/O

2 x LAN, 1 x DisplayPort and 1 x PS/2

Audio

Realtek ALC888S HD Audio

Power Requirement

24-pin ATX power from Backplane

Dimensions

168 mm x 126 mm

Operating Temperature

0 ~ 60˚C (32 ~ 140˚F) (Wide Temp Version option is -40 ~ 85˚C)

Storage Temperature

-20 ~ 80 °C (-4 ~ 176 °F)

Relative Humidity

10 ~ 90% (non-condensing)

OS Software Supported

Windows 10 64-bit

Global P/N / SKU

3308586

ORDERING OPTIONS

HE-B7371 – With Core™ i7-11850HE, QM580E, Cooler fan, DVI, DP, LVDS, VGA, 4 x PCIe X1
HE-B7374 – Same as HE-B7371, with 1 x PCIe X4
Other CPU options may be available, please inquire with your Sales Rep

Note: For display interface questions, please contact your Sales Rep

DOWNLOADS

Datasheet

ORDERING OPTIONS

HE-B7371 - With Core™ i7-11850HE, QM580E, Cooler fan, DVI, DP, LVDS, VGA, 4 x PCIe X1 HE-B7374 - Same as HE-B7371, with 1 x PCIe X4 Other CPU options may be available, please inquire with your Sales Rep Note: For display interface questions, please contact your Sales Rep

Some of our successful brand partners

Acrosser logo

Already know what you need? Request a quote.

We can customize the perfect solution to meet your embedded computing needs.

  • This field is for validation purposes and should be left unchanged.

Latest Articles

Company News

  • Darveen Partners with Global American to Expand Industrial Computing Solutions in the U.S.

    Taipei, Taiwan, August 5, 2026 – Darveen, a global leader in industrial computing, today announced a strategic partnership with Global American, Inc., a pioneer in US-based embedded systems integration for over 30 years. Under this partnership, Global American will distribute Darveen’s Panel PCs and Vehicle Mount Computers across the United States. Global American has led the industry since 1989 in delivering state-of-the-art custom […]

    View Article
  • 7 Reasons to Work with Global American

    With our long industry experience and knowledge dealing with every stage of the embedded manufacturing pipeline, we understand the needs of this task and have helped multiple clients through it. So here are the 7 reasons to choose Global American as your embedded partner. #1: Reputation for Delivering Back in 1989, when embedded computers were still just […]

    View Article
View All News

From the Blog

  • Wide Temperature Operation: A Key Factor for Industrial Computing

    What are wide temperature industrial computers? Wide temperature industrial computers are rugged PCs designed to operate reliably in extreme heat and cold where standard computers may experience component failure, instability, or thermal throttling. They typically use fanless passive cooling, industrial-grade components, sealed enclosures, and temperature-tested hardware to support demanding applications such as vehicle computing, food […]

    View Article
  • What Is a Hybrid MCU? How Microcontrollers Are Evolving for Edge AI

    MCUs or Microcontroller Units have been the norm for many embedded applications requiring specialized, efficient computing. But the industry is changing, and a simple MCU is not enough anymore.  Hybrid MCUs are the new paradigm, letting even these compact systems handle a variety of tasks themselves. But what is an MCU, and what makes one […]

    View Article
View all Blogs