MX1-10FEP – Expandable Fanless Embedded System

The MX1-10FEP is powered by Intel's Coffee Lake platform supporting Xeon and Core i-series processors. With OCP/OVP power protection and expandable design, this compact PC is the perfect solution for any complex embedded application.

Additional information

CPU

8th and 9th Generation Intel® Xeon and Core i3 / i5 / i7 Processors

CPU Socket

LGA 1151

Memory Type

260-pin DDR4 2666MHz SO-DIMM, ECC compatible with Xeon Processor

Memory Slots

2

Maximum Memory Supported

64GB

Chipset

C246

Integrated Graphics

Intel® HD Graphics

Video

1 x DP, 1 x HDMI, 1 x DVI-I

TPM

Nuvoton NPCT750AAAYX TPM 2.0

Extended Interface

1 x M.2 M-Key (2242 / 2260 / 2280), 1 x M.2 E-Key (2230), 2 x Mini PCIe Full/Half w/ SIM Card holder, 1 x PCIe x16

Rear I/O

1 x 3-pin Terminal Block Power Input, 4 x SMA Antenna (Optional for WiFi/LTE function), 1 x Line-out, 1 x 2-pin Terminal Block Remote Power on / off, 1 x 2-pin Terminal Block Remote Power reset, 1 x 4-pin Terminal Block External Fan Connector, 4 x USB 3.1, 2 x USB 2.0, 2 x RJ-45 , 1 x DP, 1 x DVI-I, 1 x PS/2, 2 x COM, 1 x Mic-in

Front I/O

2 x USB 3.0, 1 x HDMI, 2 x SIM Card Slot w/ Cover

Audio

Realtek ALC662

Power Requirement

DC input 9 ~ 48V (terminal block)

Dimensions

10.6" x 9.7" x 4.3" (268mm x 246mm x 108mm)

Operating Temperature

35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage

Relative Humidity

10 ~ 90% (non-condensing)

OS Software Supported

Windows 10 64-bit, Linux by request only

Vibration

Operating: 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)

Shock

Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)

Global P/N / SKU

1708265

Ordering Options

MX1-10FEP-C246 (SKU# 1708265):
Fanless Embedded System With Modular Expansion*

*Note: Base model does not include DC power adapter. Can be configured with 220W or 300W power adapter. System can also be expanded with COM, LAN, or PoE Modules. Please contact sales for more information.

Downloads

Datasheet

Ordering Options

MX1-10FEP-C246 (SKU# 1708265): Fanless Embedded System With Modular Expansion* *Note: Base model does not include DC power adapter. Can be configured with 220W or 300W power adapter. System can also be expanded with COM, LAN, or PoE Modules. Please contact sales for more information.

MX1-10FEP – Expandable Fanless Embedded System

The MX1-10FEP is powered by Intel’s Coffee Lake platform supporting Xeon and Core i-series processors. With OCP/OVP power protection and expandable design, this compact PC is the perfect solution for any complex embedded application.

CONTACT US NOW

System * 

CPU

Memory

mSATA

M.2 SSD

2.5″ SSD

Operating System (Only available if a storage device is selected from above.)

Testing (Only available if memory is included at time of purchase.)

SKU: 1708265 Tags: Industrial Automation, POS-Kiosk
Mitac

Additional information

CPU

8th and 9th Generation Intel® Xeon and Core i3 / i5 / i7 Processors

CPU Socket

LGA 1151

Memory Type

260-pin DDR4 2666MHz SO-DIMM, ECC compatible with Xeon Processor

Memory Slots

2

Maximum Memory Supported

64GB

Chipset

C246

Integrated Graphics

Intel® HD Graphics

Video

1 x DP, 1 x HDMI, 1 x DVI-I

TPM

Nuvoton NPCT750AAAYX TPM 2.0

Extended Interface

1 x M.2 M-Key (2242 / 2260 / 2280), 1 x M.2 E-Key (2230), 2 x Mini PCIe Full/Half w/ SIM Card holder, 1 x PCIe x16

Rear I/O

1 x 3-pin Terminal Block Power Input, 4 x SMA Antenna (Optional for WiFi/LTE function), 1 x Line-out, 1 x 2-pin Terminal Block Remote Power on / off, 1 x 2-pin Terminal Block Remote Power reset, 1 x 4-pin Terminal Block External Fan Connector, 4 x USB 3.1, 2 x USB 2.0, 2 x RJ-45 , 1 x DP, 1 x DVI-I, 1 x PS/2, 2 x COM, 1 x Mic-in

Front I/O

2 x USB 3.0, 1 x HDMI, 2 x SIM Card Slot w/ Cover

Audio

Realtek ALC662

Power Requirement

DC input 9 ~ 48V (terminal block)

Dimensions

10.6" x 9.7" x 4.3" (268mm x 246mm x 108mm)

Operating Temperature

35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage

Relative Humidity

10 ~ 90% (non-condensing)

OS Software Supported

Windows 10 64-bit, Linux by request only

Vibration

Operating: 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)

Shock

Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)

Global P/N / SKU

1708265

Ordering Options

MX1-10FEP-C246 (SKU# 1708265):
Fanless Embedded System With Modular Expansion*

*Note: Base model does not include DC power adapter. Can be configured with 220W or 300W power adapter. System can also be expanded with COM, LAN, or PoE Modules. Please contact sales for more information.

Downloads

Datasheet

Ordering Options

MX1-10FEP-C246 (SKU# 1708265): Fanless Embedded System With Modular Expansion* *Note: Base model does not include DC power adapter. Can be configured with 220W or 300W power adapter. System can also be expanded with COM, LAN, or PoE Modules. Please contact sales for more information.

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